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TANAKA Establishes Transfer Technology for its Sintered Gold (Au) Bonding Technology “AuRoFUSE Preforms”

3+ hour, 44+ min ago  (259+ words) " Advantages of being able to transfer gold bumps In this technology, at first, gold bumps are formed on a substrate (transfer substrate). Then, the gold bumps are transferred to the target semiconductor chip or substrate. Openings are created on the…...

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