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TANAKA Establishes Transfer Technology for its Sintered Gold (Au) Bonding Technology "AuRoFUSE(TM) Preforms"
3+ hour, 35+ min ago (102+ words) Advantages of being able to transfer gold bumps As the traditional gold bump formation process is a method that directly forms bumps on the target semiconductor chip or substrate, it is difficult to handle target chips and substrates with complex…...